日本日亚405nm 6868 365nm 平窗120石英玻璃片封装 3D打印机固化灯

参数

电流 Forward Current 700mA

电压 Forward Voltage 3.5-3.9V

电功率 Power Dissipation 3.08W

光功率 Radiant Flux 800mW/cm2

峰值波长 Peak Wavelength 405nm

封装尺寸：6868 6.8*6.8*1.9 L*W*H(mm)

询问中文详细规格书可以联系我，先看原文件截图

散热和焊接使用注意事项，需要中文的直接联系刘小姐

Thermal Management
● The Absolute Maximum Junction Temperature (T J ) must not be exceeded under any circumstances. The increase in the
temperature of an LED while in operation may vary depending on the PCB thermal resistance and the density of LEDs on the PCB
assembly. Ensure that when using the LEDs for the chosen application, heat is not concentrated in an area and properly managed
in the system/assembly.

● The operating current should be determined by considering the temperature conditions surrounding the LED (i.e. T A ). Ensure that
when operating the LED, proper measures are taken to dissipate the heat.
● The following two equations can be used to calculate the LED junction temperature:
1) T J =T A +R θJA �1�1W 2) T J =T S +R θJS �1�1W
*T J =LED Junction Temperature: °C

T A =Ambient Temperature: °C
T S =Soldering Temperature (Die Heat Sink): °C
R θJA =Thermal Resistance from Junction to Ambient: °C/W
R θJS =Thermal Resistance from Junction to T S Measurement Point: °C/W